BASE PART NUMBER:  MC9S12XDP512

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CAN, EBI/EMI, I²C, IRDA, LIN, SCI, SPI

CORE PROCESSOR:  HCS12X

CORE SIZE:  16-BIT

DATA CONVERTERS:  A/D 24X10B

DETAILED DESCRIPTION:  HCS12X HCS12X MICROCONTROLLER IC 16-BIT 80MHZ 512KB (512K X 8) FLASH 144-LQFP (20X20)

EEPROM SIZE:  4K X 8

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MC9S12XDP512MAG

MANUFACTURER STANDARD LEAD TIME:  10 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  119

OPERATING TEMPERATURE:  -40°C ~ 125°C (TA)

OSCILLATOR TYPE:  EXTERNAL

PACKAGE / CASE:  144-LQFP

PACKAGING:  TRAY

PERIPHERALS:  LVD, POR, PWM, WDT

PROGRAM MEMORY SIZE:  512KB (512K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  32K X 8

SERIES:  HCS12X

SPEED:  80MHZ

STANDARD PACKAGE:  300

SUPPLIER DEVICE PACKAGE:  144-LQFP (20X20)

VOLTAGE - SUPPLY (VCC/VDD):  2.35 V ~ 5.5 V