CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  CAN, EBI/EMI, ETHERNET, I²C, SPI, SSI, UART/USART, USB, USB OTG

CORE PROCESSOR:  COLDFIRE V3

CORE SIZE:  32-BIT

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MCF5329CVM240

MANUFACTURER STANDARD LEAD TIME:  10 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  94

OPERATING TEMPERATURE:  -40°C ~ 85°C (TA)

OSCILLATOR TYPE:  EXTERNAL

PACKAGE / CASE:  256-LBGA

PACKAGING:  TRAY

PERIPHERALS:  DMA, LCD, PWM, WDT

PROGRAM MEMORY TYPE:  ROMLESS

RAM SIZE:  32K X 8

SERIES:  MCF532X

SPEED:  240MHZ

STANDARD PACKAGE:  450

SUPPLIER DEVICE PACKAGE:  256-MAPBGA

VOLTAGE - SUPPLY (VCC/VDD):  1.4 V ~ 3.6 V