CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  IRDA, LIN, SCI, SPI

CORE PROCESSOR:  12V1

CORE SIZE:  16-BIT

DATA CONVERTERS:  A/D 8X10B

EEPROM SIZE:  512 X 8

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  S9S12GN16F1MLC

MANUFACTURER STANDARD LEAD TIME:  22 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  26

OPERATING TEMPERATURE:  -40°C ~ 125°C (TA)

OSCILLATOR TYPE:  INTERNAL

PACKAGE / CASE:  32-LQFP

PACKAGING:  TRAY

PERIPHERALS:  LVD, POR, PWM, WDT

PROGRAM MEMORY SIZE:  16KB (16K X 8)

PROGRAM MEMORY TYPE:  FLASH

RAM SIZE:  1K X 8

SERIES:  HCS12

SPEED:  25MHZ

STANDARD PACKAGE:  1,250

SUPPLIER DEVICE PACKAGE:  32-LQFP (7X7)

VOLTAGE - SUPPLY (VCC/VDD):  3.13 V ~ 5.5 V