SC16C554BIB64

Factory Authorized Line

NEXPERIA

Electronic Component

SC16C554BIB64

LFQFP, QFP64,.47SQ,20
Call for availability NEXPERIA
Mfr Part # SC16C554BIB64
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  LFQFPPACKAGE DESCRIPTION:  LFQFP, QFP64,.47SQ,20PACKAGE EQUIVALENCE CODE:  QFP64,.47SQ,20PACKAGE SHAPE:  SQUAREPACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCHPART PACKAGE CODE:  QFP
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADDITIONAL FEATURE:  ALSO OPERATES AT 2.5V AND 5V SUPPLY

ADDRESS BUS WIDTH:  3

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  80 MHZ

COMMUNICATION PROTOCOL:  ASYNC, BIT

DATA TRANSFER RATE-MAX:  0.625 MBPS

EXTERNAL DATA BUS WIDTH:  8

JESD-30 CODE:  S-PQFP-G64

JESD-609 CODE:  E3

LENGTH:  10 MM

LOW POWER MODE:  NO

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  SC16C554BIB64

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF SERIAL I/OS:  4

NUMBER OF TERMINALS:  64

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP64,.47SQ,20

PACKAGE EQUIVALENCE CODE:  QFP64,.47SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  64

POWER SUPPLIES:  2.5/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.6 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-MAX:  3.63 V

SUPPLY VOLTAGE-MIN:  2.97 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  10 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, SERIAL