Mfr Part #
TEA1067/C2
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: PLASTIC/EPOXYPACKAGE CODE: DIPPACKAGE DESCRIPTION: DIP,PACKAGE SHAPE: RECTANGULARPACKAGE STYLE: IN-LINEPART PACKAGE CODE: DIP
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
JESD-30 CODE: R-PDIP-T18
LENGTH: 21.6 MM
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: TEA1067/C2
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 18
OPERATING TEMPERATURE-MAX: 75 °C
OPERATING TEMPERATURE-MIN: -25 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: DIP
PACKAGE DESCRIPTION: DIP,
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
PART PACKAGE CODE: DIP
PIN COUNT: 18
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 4.7 MM
SUPPLY VOLTAGE-NOM: 2.8 V
SURFACE MOUNT: NO
TECHNOLOGY: BIPOLAR
TELECOM IC TYPE: TELEPHONE SPEECH CKT
TEMPERATURE GRADE: COMMERCIAL EXTENDED
TERMINAL FORM: THROUGH-HOLE
TERMINAL PITCH: 2.54 MM
TERMINAL POSITION: DUAL
WIDTH: 7.62 MM


