FM18L08-70-SGTR

FM18L08-70-SGTR

SOP

Call for availability

Manufactured by:

RAMTRON

Mfr Part#:  FM18L08-70-SGTR

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDSO-G28

JESD-609 CODE:  E3

LENGTH:  17.9 MM

MANUFACTURER:  RAMTRON INTERNATIONAL CORPORATION

MANUFACTURER PART NUMBER:  FM18L08-70-SGTR

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  32KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

SEATED HEIGHT-MAX:  2.65 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.65 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN) - ANNEALED

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7.5 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*