HM6264BLP-10L

Factory Authorized Line

RENESAS

Electronic Component

HM6264BLP-10L

DIP
Call for availability RENESAS
Mfr Part # HM6264BLP-10L
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  DIPPACKAGE DESCRIPTION:  DIP,PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  IN-LINEPART PACKAGE CODE:  DIP
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ACCESS TIME-MAX:  100 NS

JESD-30 CODE:  R-PDIP-T28

LENGTH:  35.6 MM

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  HM6264BLP-10L

MEMORY DENSITY:  65.536 KBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  8.192 K

NUMBER OF WORDS CODE:  8000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  8KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PIN COUNT:  28

SEATED HEIGHT-MAX:  5.7 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WIDTH:  15.24 MM