HN27C256FP-25T

HN27C256FP-25T

SOP

Call for availability

Manufactured by:

RENESAS

Mfr Part#:  HN27C256FP-25T

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  250 NS

JESD-30 CODE:  R-PDSO-G28

LENGTH:  18.3 MM

MANUFACTURER:  RENESAS ELECTRONICS CORPORATION

MANUFACTURER PART NUMBER:  HN27C256FP-25T

MEMORY DENSITY:  262.144 KBIT

MEMORY IC TYPE:  OTP ROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

NUMBER OF WORDS:  32.768 K

NUMBER OF WORDS CODE:  32000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  32KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  SOIC

PIN COUNT:  28

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

WIDTH:  8.4 MM

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