BA5972FP-E2

BA5972FP-E2

HSSOP

Call for availability

Manufactured by:

ROHM SEMICONDUCTOR

Mfr Part#:  BA5972FP-E2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HSSOP

PACKAGE DESCRIPTION:  HSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CONSUMER IC TYPE:  CONSUMER CIRCUIT

JESD-30 CODE:  R-PDSO-G28

LENGTH:  18.5 MM

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BA5972FP-E2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  28

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -35 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HSSOP

PACKAGE DESCRIPTION:  HSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

PART PACKAGE CODE:  SOIC

PIN COUNT:  28

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.3 MM

SUPPLY CURRENT-MAX:  30 MA

SUPPLY VOLTAGE-MAX (VSUP):  13.2 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  DUAL

WIDTH:  7.5 MM

Related Products