BD750L2EFJ-CE2

Factory Authorized Line

ROHM SEMICONDUCTOR

Electronic Component

BD750L2EFJ-CE2

VSOP, TSOP8,.25
Call for availability ROHM SEMICONDUCTOR
Mfr Part # BD750L2EFJ-CE2
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  VSOPPACKAGE DESCRIPTION:  VSOP, TSOP8,.25PACKAGE EQUIVALENCE CODE:  TSOP8,.25PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  SMALL OUTLINE, VERY THIN PROFILEPACKING METHOD:  TAPE AND REEL
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ADJUSTABILITY:  FIXED

DROPOUT VOLTAGE1-MAX:  700 MV

DROPOUT VOLTAGE1-NOM:  400 MV

FEATURE:  FIXED,POSITIVE,SINGLE OUTPUT,LDO

INPUT VOLTAGE ABSOLUTE-MAX:  50 V

INPUT VOLTAGE-MAX:  45 V

INPUT VOLTAGE-MIN:  5.8 V

JESD-30 CODE:  R-PDSO-G8

LENGTH:  4.9 MM

LINE REGULATION-MAX:  0.02 %

LOAD REGULATION-MAX:  0.02 %

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  BD750L2EFJ-CE2

NUMBER OF FUNCTIONS:  1

NUMBER OF OUTPUTS:  1

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE TJ-MAX:  150 °C

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CURRENT1-MAX:  200 MA

OUTPUT VOLTAGE1-MAX:  5.1 V

OUTPUT VOLTAGE1-MIN:  4.9 V

OUTPUT VOLTAGE1-NOM:  5 V

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VSOP

PACKAGE DESCRIPTION:  VSOP, TSOP8,.25

PACKAGE EQUIVALENCE CODE:  TSOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, VERY THIN PROFILE

PACKING METHOD:  TAPE AND REEL

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

QUALIFICATION STATUS:  NOT QUALIFIED

REGULATOR TYPE:  FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

SCREENING LEVEL:  AEC-Q100

SEATED HEIGHT-MAX:  1 MM

SUBCATEGORY:  OTHER REGULATORS

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

VOLTAGE TOLERANCE-MAX:  2 %

WIDTH:  3.9 MM