CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  MCR03EZHJ681

MANUFACTURER SERIES:  MCR03

MOUNTING FEATURE:  SURFACE MOUNT

OPERATING TEMPERATURE-MAX:  155 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 0603

PACKAGE HEIGHT:  450 ΜM

PACKAGE LENGTH:  1.6 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  800 ΜM

PACKING METHOD:  TR, PAPER, 7 INCH

RATED POWER DISSIPATION (P):  100 MW

RATED TEMPERATURE:  70 °C

RESISTANCE:  680 O

RESISTOR TYPE:  FIXED RESISTOR

SERIES:  MCR03(J,200PPM)

SIZE CODE:  0603

SUBCATEGORY:  FIXED RESISTORS

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  200 PPM/°C

TERMINAL FINISH:  TIN (SN) - WITH NICKEL (NI) BARRIER

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  5 %

WORKING VOLTAGE:  50 V