CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  ROHM SEMICONDUCTOR

MANUFACTURER PART NUMBER:  MCR25JZHF8200

MANUFACTURER SERIES:  MCR

MOUNTING FEATURE:  SURFACE MOUNT

OPERATING TEMPERATURE-MAX:  155 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 1210

PACKAGE HEIGHT:  550 ΜM

PACKAGE LENGTH:  3.2 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  2.5 MM

PACKING METHOD:  TR, EMBOSSED, 7 INCH

PBFREE CODE:  YES

RATED POWER DISSIPATION (P):  250 MW

RATED TEMPERATURE:  70 °C

REFERENCE STANDARD:  AEC-Q200

RESISTANCE:  820 O

RESISTOR TYPE:  FIXED RESISTOR

SERIES:  MCR(AUTOMOTIVE)

SIZE CODE:  1210

SUBCATEGORY:  FIXED RESISTOR

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  100 PPM/°C

TERMINAL FINISH:  TIN (SN) - WITH NICKEL (NI) BARRIER

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  1 %

WORKING VOLTAGE:  200 V