Mfr Part #
PML18EZPGV2L50
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE DESCRIPTION: SMT, 1206PACKAGE LENGTH: 3.2 MMPACKAGE SHAPE: RECTANGULAR PACKAGEPACKAGE STYLE: SMTPACKAGE WIDTH: 1.6 MMPACKING METHOD: TR, PAPER, 7 INCH
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: ROHM SEMICONDUCTOR
MANUFACTURER PART NUMBER: PML18EZPGV2L50
MOUNTING FEATURE: SURFACE MOUNT
NUMBER OF TERMINALS: 2
OPERATING TEMPERATURE-MAX: 155 °C
OPERATING TEMPERATURE-MIN: -55 °C
PACKAGE DESCRIPTION: SMT, 1206
PACKAGE LENGTH: 3.2 MM
PACKAGE SHAPE: RECTANGULAR PACKAGE
PACKAGE STYLE: SMT
PACKAGE WIDTH: 1.6 MM
PACKING METHOD: TR, PAPER, 7 INCH
RATED POWER DISSIPATION (P): 1 W
RATED TEMPERATURE: 70 °C
RESISTANCE: 2.5 MO
RESISTOR TYPE: FIXED RESISTOR
SIZE CODE: 1206
SUBCATEGORY: FIXED RESISTOR
SURFACE MOUNT: YES
TECHNOLOGY: METAL GLAZE/THICK FILM
TEMPERATURE COEFFICIENT: 150 PPM/°C
TERMINAL FINISH: TIN
TERMINAL SHAPE: ONE SURFACE
TOLERANCE: 2 %








