CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  ROYAL ELECTRONIC FACTORY (THAILAND) CO LTD

MANUFACTURER PART NUMBER:  HP06W2J0181T5E

MANUFACTURER SERIES:  HP06

MOUNTING FEATURE:  SURFACE MOUNT

NUMBER OF TERMINALS:  2

OPERATING TEMPERATURE-MAX:  155 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 1206

PACKAGE HEIGHT:  550 ΜM

PACKAGE LENGTH:  3.1 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  1.55 MM

PACKING METHOD:  TR

PBFREE CODE:  YES

RATED POWER DISSIPATION (P):  500 MW

RATED TEMPERATURE:  70 °C

RESISTANCE:  180 O

RESISTOR TYPE:  FIXED RESISTOR

SERIES:  HP

SIZE CODE:  1206

SUBCATEGORY:  FIXED RESISTOR

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  100 PPM/°C

TERMINAL FINISH:  MATTE TIN (SN) - WITH NICKEL (NI) BARRIER

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  5 %

WORKING VOLTAGE:  200 V