ACCESS TIME-MAX:  600 PS

CLOCK FREQUENCY-MAX (FCLK):  275 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  2,4,8

JESD-30 CODE:  S-PBGA-B144

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K4D263238G-VC36

MEMORY DENSITY:  134.2177 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  32

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  144

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING TEMPERATURE-MAX:  65 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  4MX32

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE DESCRIPTION:  FBGA, BGA144,12X12,32

PACKAGE EQUIVALENCE CODE:  BGA144,12X12,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

POWER SUPPLIES:  2.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  4096

SEQUENTIAL BURST LENGTH:  2,4,8

STANDBY CURRENT-MAX:  15 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  392 ΜA

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM