ACCESS TIME-MAX:  70 NS

I/O TYPE:  COMMON

JESD-30 CODE:  R-PBGA-B48

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K6F1616R6C-FF70

MEMORY DENSITY:  16.7772 MBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  16

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1MX16

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE DESCRIPTION:  FBGA, BGA48,6X8,30

PACKAGE EQUIVALENCE CODE:  BGA48,6X8,30

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

STANDBY VOLTAGE-MIN:  1 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  22 ΜA

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  750 ΜM

TERMINAL POSITION:  BOTTOM