ACCESS TIME-MAX:  450 PS

CLOCK FREQUENCY-MAX (FCLK):  250 MHZ

I/O TYPE:  SEPARATE

JESD-30 CODE:  R-PBGA-B165

JESD-609 CODE:  E0

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  K7R161884B-FC25

MEMORY DENSITY:  18.8744 MBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  18

NUMBER OF TERMINALS:  165

NUMBER OF WORDS:  1.0486 M

NUMBER OF WORDS CODE:  1000000

OPERATING MODE:  SYNCHRONOUS

ORGANIZATION:  1MX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA165,11X15,40

PACKAGE EQUIVALENCE CODE:  BGA165,11X15,40

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PARALLEL/SERIAL:  PARALLEL

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

POWER SUPPLIES:  1.5/1.8,1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

STANDBY CURRENT-MAX:  180 MA

STANDBY VOLTAGE-MIN:  1.7 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  400 ΜA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED