ACCESS TIME-MAX:  250 NS

COMMAND USER INTERFACE:  NO

DATA POLLING:  NO

JESD-30 CODE:  R-PDIP-T24

JESD-609 CODE:  E0

MANUFACTURER:  SAMSUNG SEMICONDUCTOR

MANUFACTURER PART NUMBER:  KM2816A-25

MEMORY DENSITY:  16.384 KBIT

MEMORY IC TYPE:  EEPROM

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  24

NUMBER OF WORDS:  2.048 K

NUMBER OF WORDS CODE:  2000

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  2KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP24,.6

PACKAGE EQUIVALENCE CODE:  DIP24,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  260

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

STANDBY CURRENT-MAX:  50 MA

SUBCATEGORY:  EEPROMS

SUPPLY CURRENT-MAX:  110 ΜA

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  MOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

TOGGLE BIT:  NO