EXTERNAL DATA BUS WIDTH:  16

HOST DATA TRANSFER RATE-MAX:  20 MBPS

HOST INTERFACE STANDARD:  ISA

JESD-30 CODE:  R-PBGA-B69

LENGTH:  12 MM

MANUFACTURER:  SANDISK CORPORATION

MANUFACTURER PART NUMBER:  MD3831-D32-V3-X

NUMBER OF TERMINALS:  69

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PIN COUNT:  69

SEATED HEIGHT-MAX:  1.3 MM

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  2.7 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  9 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE