ADDITIONAL FEATURE:  SCRAM IS ORGANISED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH

JESD-30 CODE:  R-PBGA-B115

LENGTH:  14 MM

MANUFACTURER:  SHARP MICROELECTRONICS OF THE AMERICAS

MANUFACTURER PART NUMBER:  LRS1830

MEMORY DENSITY:  134.2177 MBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  115

NUMBER OF WORDS:  8.3886 M

NUMBER OF WORDS CODE:  8000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -30 °C

ORGANIZATION:  8MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PIN COUNT:  115

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.1 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  9 MM