ADDITIONAL FEATURE:  SMARTCOMBO RAM IS ORGANISED AS 2M X 16 AND OPERATES AT 2.7V TO 3.1V SUPPLY

JESD-30 CODE:  R-PBGA-B72

LENGTH:  11 MM

MANUFACTURER:  SHARP MICROELECTRONICS OF THE AMERICAS

MANUFACTURER PART NUMBER:  LRS1834

MEMORY DENSITY:  100.6633 MBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  72

NUMBER OF WORDS:  6.2915 M

NUMBER OF WORDS CODE:  6000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -30 °C

ORGANIZATION:  6MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFBGA

PACKAGE DESCRIPTION:  LFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PIN COUNT:  72

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.4 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.3 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  8 MM