IS63LV1024L-12T

Factory Authorized Line

SII SEMICONDUCTOR

Electronic Component

IS63LV1024L-12T

TSOP2
Call for availability SII SEMICONDUCTOR
Mfr Part # IS63LV1024L-12T
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  TSOP2PACKAGE DESCRIPTION:  TSOP2,PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  SMALL OUTLINE, THIN PROFILEPART PACKAGE CODE:  TSOP2
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ACCESS TIME-MAX:  12 NS

JESD-30 CODE:  R-PDSO-G32

LENGTH:  20.95 MM

MANUFACTURER:  SII SEMICONDUCTOR CORPORATION

MANUFACTURER PART NUMBER:  IS63LV1024L-12T

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  STANDARD SRAM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  131.072 K

NUMBER OF WORDS CODE:  128000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  128KX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSOP2

PACKAGE DESCRIPTION:  TSOP2,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  TSOP2

PIN COUNT:  32

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

WIDTH:  10.16 MM