ADDRESS BUS WIDTH:  0

BIT SIZE:  32

CPU FAMILY:  CORTEX-M3

CLOCK FREQUENCY-MAX:  50 MHZ

DAC CHANNELS:  YES

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  0

HAS ADC:  YES

JESD-30 CODE:  S-PBGA-B80

LENGTH:  5.5 MM

MANUFACTURER:  SILICON LABORATORIES INC

MANUFACTURER PART NUMBER:  SIM3L167-C-GL

NUMBER OF I/O LINES:  62

NUMBER OF TERMINALS:  80

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA80,10X10,20

PACKAGE EQUIVALENCE CODE:  BGA80,10X10,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

POWER SUPPLIES:  2/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  32768

ROM (WORDS):  262144

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.2 MM

SPEED:  50 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY VOLTAGE-MAX:  3.8 V

SUPPLY VOLTAGE-MIN:  1.8 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  5.5 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC