JESD-30 CODE:  R-PBGA-B153

LENGTH:  13 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H26M41208HPR

MEMORY DENSITY:  68.7195 GBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  153

NUMBER OF WORDS:  8.5899 G

NUMBER OF WORDS CODE:  8000000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -25 °C

ORGANIZATION:  8GX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PROGRAMMING VOLTAGE:  3.3 V

SEATED HEIGHT-MAX:  800 ΜM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  11.5 MM