H5PS5182GFR-Y5C

Factory Authorized Line

SK HYNIX

Electronic Component

H5PS5182GFR-Y5C

TFBGA, BGA60,9X11,32
Call for availability SK HYNIX
Mfr Part # H5PS5182GFR-Y5C
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  TFBGAPACKAGE DESCRIPTION:  TFBGA, BGA60,9X11,32PACKAGE EQUIVALENCE CODE:  BGA60,9X11,32PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCHPART PACKAGE CODE:  BGA
Contact Sales

Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  450 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  333 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  4,8

JESD-30 CODE:  R-PBGA-B60

JESD-609 CODE:  E1

LENGTH:  9.5 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H5PS5182GFR-Y5C

MEMORY DENSITY:  536.8709 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  60

NUMBER OF WORDS:  67.1089 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  95 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64MX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA60,9X11,32

PACKAGE EQUIVALENCE CODE:  BGA60,9X11,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  60

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  8192

SEATED HEIGHT-MAX:  1.2 MM

SEQUENTIAL BURST LENGTH:  4,8

STANDBY CURRENT-MAX:  7 MA

SUBCATEGORY:  DRAMS

SUPPLY CURRENT-MAX:  110 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  1.9 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  7.5 MM