ACCESS MODE:  MULTI BANK PAGE BURST

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

JESD-30 CODE:  R-PBGA-B78

LENGTH:  11 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  H5TC4G83CFR-PBA

MEMORY DENSITY:  4.295 GBIT

MEMORY IC TYPE:  DRAM MODULE

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  78

NUMBER OF WORDS:  536.8709 M

NUMBER OF WORDS CODE:  512000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  512MX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  260

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  1.45 V

SUPPLY VOLTAGE-MIN (VSUP):  1.283 V

SUPPLY VOLTAGE-NOM (VSUP):  1.35 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

WIDTH:  7.5 MM