ACCESS TIME-MAX:  30 NS

COMMAND USER INTERFACE:  YES

DATA POLLING:  NO

JESD-30 CODE:  R-PBGA-B63

JESD-609 CODE:  E1

LENGTH:  11 MM

MANUFACTURER:  SK HYNIX INC

MANUFACTURER PART NUMBER:  HY27US08121A-FPIB

MEMORY DENSITY:  512.7537 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  4K

NUMBER OF TERMINALS:  63

NUMBER OF WORDS:  67.1089 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  64MX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA, BGA63,10X12,32

PACKAGE EQUIVALENCE CODE:  BGA63,10X12,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PAGE SIZE:  512 WORDS

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  63

POWER SUPPLIES:  3.3 V

PROGRAMMING VOLTAGE:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SEATED HEIGHT-MAX:  1 MM

SECTOR SIZE:  16K

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  20 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN SILVER COPPER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  20

TOGGLE BIT:  NO

TYPE:  NAND TYPE

WIDTH:  9 MM