ADDRESS BUS WIDTH:  32

BOUNDARY SCAN:  NO

BUS COMPATIBILITY:  PCI

CLOCK FREQUENCY-MAX:  33 MHZ

EXTERNAL DATA BUS WIDTH:  32

JESD-30 CODE:  S-PBGA-B324

JESD-609 CODE:  E0

LENGTH:  27 MM

MANUFACTURER:  SMSC

MANUFACTURER PART NUMBER:  SLC90E66-UF

NUMBER OF I/O LINES:  53

NUMBER OF TERMINALS:  324

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  324

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  256

SEATED HEIGHT-MAX:  2.56 MM

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  27 MM