ACCESS TIME-MAX:  2.2 NS

CLOCK FREQUENCY-MAX (FCLK):  285 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PBGA-B153

JESD-609 CODE:  E0

LENGTH:  22 MM

MANUFACTURER:  SONY SEMICONDUCTOR

MANUFACTURER PART NUMBER:  CXK77R1882AGB-35

MEMORY DENSITY:  9.4372 MBIT

MEMORY IC TYPE:  DDR SRAM

MEMORY WIDTH:  18

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  153

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  512KX18

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA153,9X17,50

PACKAGE EQUIVALENCE CODE:  BGA153,9X17,50

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  153

POWER SUPPLIES:  1.5/1.8,2.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.3 MM

STANDBY CURRENT-MAX:  440 MA

STANDBY VOLTAGE-MIN:  2.38 V

SUBCATEGORY:  SRAMS

SUPPLY CURRENT-MAX:  880 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  2.63 V

SUPPLY VOLTAGE-MIN (VSUP):  2.37 V

SUPPLY VOLTAGE-NOM (VSUP):  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  10

WIDTH:  14 MM