Mfr Part #
CXN1000-3BAL
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE BODY MATERIAL: PLASTIC/EPOXYPACKAGE DESCRIPTION: , MODULE(UNSPEC)PACKAGE EQUIVALENCE CODE: MODULE(UNSPEC)PACKAGE STYLE: MICROELECTRONIC ASSEMBLY
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
MANUFACTURER: SONY SEMICONDUCTOR
MANUFACTURER PART NUMBER: CXN1000-3BAL
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE DESCRIPTION: , MODULE(UNSPEC)
PACKAGE EQUIVALENCE CODE: MODULE(UNSPEC)
PACKAGE STYLE: MICROELECTRONIC ASSEMBLY
POWER SUPPLIES: 3/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: OTHER TELECOM ICS
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL

