AM27C010-70DI

AM27C010-70DI

DIP

Call for availability

Manufactured by:

SPANSION

Mfr Part#:  AM27C010-70DI

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCESS TIME-MAX:  70 NS

JESD-30 CODE:  R-CDIP-T32

LENGTH:  42.1 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  AM27C010-70DI

MEMORY DENSITY:  1.0486 MBIT

MEMORY IC TYPE:  UVPROM

MEMORY WIDTH:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  32

NUMBER OF WORDS:  131.072 K

NUMBER OF WORDS CODE:  128000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  128KX8

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  DIP

PIN COUNT:  32

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  5.588 MM

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WIDTH:  15.24 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*