ACCESS TIME-MAX:  70 NS

ADDITIONAL FEATURE:  SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

BOOT BLOCK:  TOP

COMMAND USER INTERFACE:  YES

COMMON FLASH INTERFACE:  YES

DATA POLLING:  YES

JESD-30 CODE:  R-PBGA-B44

JESD-609 CODE:  E0

LENGTH:  9.2 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  AM29BDS643GT7MVAI

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  8,126

NUMBER OF TERMINALS:  44

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA, BGA44,8X14,20

PACKAGE EQUIVALENCE CODE:  BGA44,8X14,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  44

POWER SUPPLIES:  1.8 V

PROGRAMMING VOLTAGE:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SEATED HEIGHT-MAX:  1 MM

SECTOR SIZE:  8K,32K

STANDBY CURRENT-MAX:  10 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  60 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  1.9 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

TOGGLE BIT:  YES

TYPE:  NOR TYPE

WIDTH:  8 MM