S29AL008D70TFI022

Factory Authorized Line

SPANSION

Electronic Component

S29AL008D70TFI022

TSSOP, TSSOP48,.8,20
Call for availability SPANSION
Mfr Part # S29AL008D70TFI022
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE BODY MATERIAL:  PLASTIC/EPOXYPACKAGE CODE:  TSSOPPACKAGE DESCRIPTION:  TSSOP, TSSOP48,.8,20PACKAGE EQUIVALENCE CODE:  TSSOP48,.8,20PACKAGE SHAPE:  RECTANGULARPACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ACCESS TIME-MAX:  70 NS

ALTERNATE MEMORY WIDTH:  8

BOOT BLOCK:  BOTTOM

COMMAND USER INTERFACE:  YES

DATA POLLING:  YES

ENDURANCE:  1000000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PDSO-G48

JESD-609 CODE:  E3

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  S29AL008D70TFI022

MEMORY DENSITY:  8.3886 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF SECTORS/SIZE:  1,2,1,15

NUMBER OF TERMINALS:  48

NUMBER OF WORDS:  524.288 K

NUMBER OF WORDS CODE:  512000

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  512KX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP48,.8,20

PACKAGE EQUIVALENCE CODE:  TSSOP48,.8,20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PARALLEL/SERIAL:  PARALLEL

POWER SUPPLIES:  3/3.3 V

READY/BUSY:  YES

SECTOR SIZE:  16K,8K,32K,64K

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  35 ΜA

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  DUAL

TOGGLE BIT:  YES

TYPE:  NOR TYPE