ACCESS TIME-MAX:  90 NS

ALTERNATE MEMORY WIDTH:  8

COMMAND USER INTERFACE:  YES

COMMON FLASH INTERFACE:  YES

DATA POLLING:  YES

JESD-30 CODE:  R-PBGA-B64

JESD-609 CODE:  E0

LENGTH:  13 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  S29GL064N90FAI022

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  16

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  128

NUMBER OF TERMINALS:  64

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  4MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA, BGA64,8X8,40

PACKAGE EQUIVALENCE CODE:  BGA64,8X8,40

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PAGE SIZE:  8/16 WORDS

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PBFREE CODE:  NO

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  64

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SEATED HEIGHT-MAX:  1.4 MM

SECTOR SIZE:  64K

STANDBY CURRENT-MAX:  5 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  50 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

TOGGLE BIT:  YES

TYPE:  NOR TYPE

WIDTH:  11 MM