ACCESS TIME-MAX:  100 NS

COMMAND USER INTERFACE:  YES

COMMON FLASH INTERFACE:  YES

DATA POLLING:  YES

JESD-30 CODE:  S-PBGA-B64

JESD-609 CODE:  E1

LENGTH:  9 MM

MANUFACTURER:  SPANSION

MANUFACTURER PART NUMBER:  S29GL512S10DHI020

MEMORY DENSITY:  512.7537 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF SECTORS/SIZE:  512

NUMBER OF TERMINALS:  64

NUMBER OF WORDS:  67.1089 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  64MX8

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LBGA

PACKAGE DESCRIPTION:  LBGA, BGA64,8X8,40

PACKAGE EQUIVALENCE CODE:  BGA64,8X8,40

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, LOW PROFILE

PAGE SIZE:  16 WORDS

PARALLEL/SERIAL:  PARALLEL

PART PACKAGE CODE:  BGA

PIN COUNT:  64

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  2.7 V

QUALIFICATION STATUS:  NOT QUALIFIED

READY/BUSY:  YES

SEATED HEIGHT-MAX:  1.4 MM

SECTOR SIZE:  64K

STANDBY CURRENT-MAX:  100 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  80 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/SILVER/COPPER (SN96.5AG3.0CU0.5)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TOGGLE BIT:  YES

TYPE:  NOR TYPE

WIDTH:  9 MM