CONSTRUCTION:  CHIP

JESD-609 CODE:  E3

MANUFACTURER:  TA-I TECHNOLOGY CO LTD

MANUFACTURER PART NUMBER:  RM12JTN750

MANUFACTURER SERIES:  RM12

MOUNTING FEATURE:  SURFACE MOUNT

NUMBER OF TERMINALS:  2

OPERATING TEMPERATURE-MAX:  155 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE DESCRIPTION:  SMT, 1206

PACKAGE HEIGHT:  550 ΜM

PACKAGE LENGTH:  3.1 MM

PACKAGE SHAPE:  RECTANGULAR PACKAGE

PACKAGE STYLE:  SMT

PACKAGE WIDTH:  1.55 MM

PACKING METHOD:  TR, PAPER, 7/10 INCH

PBFREE CODE:  YES

RATED POWER DISSIPATION (P):  250 MW

RATED TEMPERATURE:  70 °C

RESISTANCE:  75 O

RESISTOR TYPE:  FIXED RESISTOR

SERIES:  RM(STANDARD)

SIZE CODE:  1206

SUBCATEGORY:  FIXED RESISTOR

SURFACE MOUNT:  YES

TECHNOLOGY:  METAL GLAZE/THICK FILM

TEMPERATURE COEFFICIENT:  200 PPM/°C

TERMINAL FINISH:  MATTE TIN (SN) - REFLOWED OVER NICKEL (NI) BARRIER

TERMINAL SHAPE:  WRAPAROUND

TOLERANCE:  5 %

WORKING VOLTAGE:  200 V