JESD-30 CODE:  R-XBGA-B303

JESD-609 CODE:  E0

MANUFACTURER:  THOMSON-CSF COMPSANTS SPECIFIC

MANUFACTURER PART NUMBER:  TSPC106AMGU66CG

NUMBER OF TERMINALS:  303

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE BODY MATERIAL:  CERAMIC

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA, BGA303,19X16,50

PACKAGE EQUIVALENCE CODE:  BGA303,19X16,50

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  MEMORY CONTROLLERS

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM