ADDITIONAL FEATURE:  LOW CAPACITANCE

BREAKDOWN VOLTAGE-MAX:  20 V

BREAKDOWN VOLTAGE-MIN:  10 V

CONFIGURATION:  COMMON BIPOLAR TERMINAL, 2 ELEMENTS

DIODE ELEMENT MATERIAL:  SILICON

DIODE TYPE:  TRANS VOLTAGE SUPPRESSOR DIODE

JESD-30 CODE:  R-XBCC-N3

JESD-609 CODE:  E3/E4

MANUFACTURER:  TRIQUINT SEMICONDUCTOR

MANUFACTURER PART NUMBER:  TQP200002

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF ELEMENTS:  2

NUMBER OF TERMINALS:  3

PACKAGE BODY MATERIAL:  UNSPECIFIED

PACKAGE DESCRIPTION:  R-XBCC-N3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  CHIP CARRIER

PART PACKAGE CODE:  DFN

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  3

POLARITY:  BIDIRECTIONAL

SURFACE MOUNT:  YES

TECHNOLOGY:  AVALANCHE

TERMINAL FINISH:  MATTE TIN/GOLD

TERMINAL FORM:  NO LEAD

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED