Mfr Part #
WSLP20103L000FEA
Qty in Stock
Call for availability
Factory Stock
N/A
Minimum Order
1
Packaging
PACKAGE DESCRIPTION: SMT, 2010PACKAGE HEIGHT: 635 ΜMPACKAGE LENGTH: 5.08 MMPACKAGE STYLE: SMTPACKAGE WIDTH: 2.54 MMPACKING METHOD: TR, EMBOSSED PLASTIC, 7 INCH
Availability
- Qty in StockCall for availability
- Min. Order Qty1
Specification
CONSTRUCTION: CHIP
JESD-609 CODE: E3
MANUFACTURER: VISHAY INTERTECHNOLOGIES
MANUFACTURER PART NUMBER: WSLP20103L000FEA
OPERATING TEMPERATURE-MAX: 170 °C
OPERATING TEMPERATURE-MIN: -65 °C
PACKAGE DESCRIPTION: SMT, 2010
PACKAGE HEIGHT: 635 ΜM
PACKAGE LENGTH: 5.08 MM
PACKAGE STYLE: SMT
PACKAGE WIDTH: 2.54 MM
PACKING METHOD: TR, EMBOSSED PLASTIC, 7 INCH
RATED POWER DISSIPATION (P): 2 W
RESISTANCE: 3 MO
RESISTOR TYPE: FIXED RESISTOR
SERIES: WSLP
SIZE CODE: 2010
SUBCATEGORY: FIXED RESISTOR
TECHNOLOGY: METAL STRIP
TEMPERATURE COEFFICIENT: -150,150 PPM/°C
TERMINAL FINISH: MATTE TIN (SN) - WITH NICKEL (NI) BARRIER
TOLERANCE: 1 %







