ATTACHMENT METHOD:  THERMAL TAPE, ADHESIVE (INCLUDED)

CATEGORIES:  FANS, THERMAL MANAGEMENT

DETAILED DESCRIPTION:  HEAT SINK ASSORTED (BGA, LGA, CPU, ASIC...) ALUMINUM BOARD LEVEL

HEIGHT OFF BASE (HEIGHT OF FIN):  0.350" (8.89MM)

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

LENGTH:  0.650" (16.51MM)

MANUFACTURER:  WAKEFIELD-VETTE

MANUFACTURER PART NUMBER:  LTN20069

MANUFACTURER STANDARD LEAD TIME:  12 WEEKS

MATERIAL:  ALUMINUM

MATERIAL FINISH:  BLACK ANODIZED

MOISTURE SENSITIVITY LEVEL (MSL):  1 (UNLIMITED)

PACKAGE COOLED:  ASSORTED (BGA, LGA, CPU, ASIC...)

SERIES:  PENGUIN

SHAPE:  SQUARE, FINS

STANDARD PACKAGE:  3,072

THERMAL RESISTANCE @ FORCED AIR FLOW:  8.00°C/W @ 500 LFM

TYPE:  BOARD LEVEL

WIDTH:  0.653" (16.59MM)