CLOCK FREQUENCY-MAX (FCLK):  104 MHZ

DATA RETENTION TIME-MIN:  10

ENDURANCE:  100000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PBGA-B24

LENGTH:  8 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25N01GVTCIG

MEMORY DENSITY:  1.0737 GBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  24

NUMBER OF WORDS:  1.0737 G

NUMBER OF WORDS CODE:  1000000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  1GX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TBGA

PACKAGE DESCRIPTION:  TBGA, BGA24,4X6,40

PACKAGE EQUIVALENCE CODE:  BGA24,4X6,40

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE

PARALLEL/SERIAL:  SERIAL

POWER SUPPLIES:  3/3.3 V

PROGRAMMING VOLTAGE:  3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  35 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.7 V

SUPPLY VOLTAGE-NOM (VSUP):  3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

TYPE:  NOR TYPE

WIDTH:  6 MM

WRITE PROTECTION:  HARDWARE/SOFTWARE