CLOCK FREQUENCY-MAX (FCLK):  104 MHZ

DATA RETENTION TIME-MIN:  20

ENDURANCE:  100000 WRITE/ERASE CYCLES

JESD-30 CODE:  R-PBGA-B16

LENGTH:  3.143 MM

MANUFACTURER:  WINBOND ELECTRONICS CORP

MANUFACTURER PART NUMBER:  W25Q64FWBYIG

MEMORY DENSITY:  64.0942 MBIT

MEMORY IC TYPE:  FLASH

MEMORY WIDTH:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  16

NUMBER OF WORDS:  64.0942 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

ORGANIZATION:  64MX1

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA, BGA16,4X4,32/20

PACKAGE EQUIVALENCE CODE:  BGA16,4X4,32/20

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  16

POWER SUPPLIES:  1.8 V

PROGRAMMING VOLTAGE:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  512 ΜM

SERIAL BUS TYPE:  SPI

STANDBY CURRENT-MAX:  20 ΜA

SUBCATEGORY:  FLASH MEMORIES

SUPPLY CURRENT-MAX:  25 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  1.95 V

SUPPLY VOLTAGE-MIN (VSUP):  1.65 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

TYPE:  NOR TYPE

WIDTH:  2.495 MM

WRITE PROTECTION:  HARDWARE/SOFTWARE