ADDITIONAL FEATURE:  USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

CLOCK FREQUENCY-MAX (FCLK):  10 MHZ

I/O TYPE:  COMMON

JESD-30 CODE:  R-PDIP-T8

JESD-609 CODE:  E0

LENGTH:  9.3599 MM

MANUFACTURER:  XILINX

MANUFACTURER PART NUMBER:  XC1736EPD8C

MEMORY DENSITY:  36.288 KBIT

MEMORY IC TYPE:  CONFIGURATION MEMORY

MEMORY WIDTH:  1

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  8

NUMBER OF WORDS:  36.288 K

NUMBER OF WORDS CODE:  36288

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  36288X1

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP8,.3

PACKAGE EQUIVALENCE CODE:  DIP8,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PARALLEL/SERIAL:  SERIAL

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  225

PIN COUNT:  8

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.5974 MM

STANDBY CURRENT-MAX:  50 ΜA

SUBCATEGORY:  OTP ROMS

SUPPLY CURRENT-MAX:  10 ΜA

SUPPLY VOLTAGE-MAX (VSUP):  5.25 V

SUPPLY VOLTAGE-MIN (VSUP):  4.75 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN85PB15)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  7.62 MM