BASE PART NUMBER:  IXG*200N60

CATEGORIES:  DISCRETE SEMICONDUCTOR PRODUCTS

CONFIGURATION:  SINGLE

CURRENT - COLLECTOR (IC) (MAX):  300A

CURRENT - COLLECTOR CUTOFF (MAX):  50ΜA

DETAILED DESCRIPTION:  IGBT MODULE PT SINGLE 600V 300A 830W CHASSIS MOUNT SOT-227B

IGBT TYPE:  PT

INPUT:  STANDARD

INPUT CAPACITANCE (CIES) @ VCE:  26NF @ 25V

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  IXYS

MANUFACTURER PART NUMBER:  IXGN200N60B3

MANUFACTURER STANDARD LEAD TIME:  24 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  1 (UNLIMITED)

MOUNTING TYPE:  CHASSIS MOUNT

NTC THERMISTOR:  NO

OPERATING TEMPERATURE:  -55°C ~ 150°C (TJ)

PACKAGE / CASE:  SOT-227-4, MINIBLOC

POWER - MAX:  830W

SERIES:  GENX3?

STANDARD PACKAGE:  10

SUPPLIER DEVICE PACKAGE:  SOT-227B

VCE(ON) (MAX) @ VGE, IC:  1.5V @ 15V, 100A

VOLTAGE - COLLECTOR EMITTER BREAKDOWN (MAX):  600V