A2F500M3G-FGG256

Factory Authorized Line

MICROSEMI

Electronic Component

A2F500M3G-FGG256

ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION® PROASIC®3 FPGA, 500K GATES, 11520 D-FLIP-FLOPS 512KB 64KB 80MHZ 256-FBGA (17X17)
Call for availability MICROSEMI
Mfr Part # A2F500M3G-FGG256
Qty in Stock Call for availability
Factory Stock N/A
Minimum Order 1
Packaging PACKAGE / CASE:  256-LBGAPACKAGING:  TRAYSTANDARD PACKAGE:  1SUPPLIER DEVICE PACKAGE:  256-FBGA (17X17)
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Availability

  • Qty in StockCall for availability
  • Min. Order Qty1
Specification

ARCHITECTURE:  MCU, FPGA

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CONNECTIVITY:  EBI/EMI, ETHERNET, I²C, SPI, UART/USART

CORE PROCESSOR:  ARM® CORTEX®-M3

DETAILED DESCRIPTION:  ARM® CORTEX®-M3 SYSTEM ON CHIP (SOC) IC SMARTFUSION® PROASIC®3 FPGA, 500K GATES, 11520 D-FLIP-FLOPS 512KB 64KB 80MHZ 256-FBGA (17X17)

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MCU FLASH:  512KB

MCU RAM:  64KB

MANUFACTURER:  MICROSEMI CORPORATION

MANUFACTURER PART NUMBER:  A2F500M3G-FGG256

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF I/O:  MCU - 25, FPGA - 66

OPERATING TEMPERATURE:  0°C ~ 85°C (TJ)

PACKAGE / CASE:  256-LBGA

PACKAGING:  TRAY

PERIPHERALS:  DMA, POR, WDT

PRIMARY ATTRIBUTES:  PROASIC®3 FPGA, 500K GATES, 11520 D-FLIP-FLOPS

SERIES:  SMARTFUSION®

SPEED:  80MHZ

STANDARD PACKAGE:  1

SUPPLIER DEVICE PACKAGE:  256-FBGA (17X17)