Electronic Component
XCZU9EG-1FFVC900I
QUAD ARM® CORTEX®-A53 MPCORE? WITH CORESIGHT?, DUAL ARM®CORTEX?-R5 WITH CORESIGHT?, ARM MALI?-400 MP2 SYSTEM ON CHIP (SOC) IC ZYNQ® ULTRASCALE+? MPSOC EG ZYNQ®ULTRASCALE+? FPGA, 599K+ LOGIC CELLS 256KB 500MHZ, 600MHZ, 1.2GHZ 900-FCBGA (31X31)Availability
- Qty in StockCall for availability
- Min. Order Qty1
ARCHITECTURE: MCU, FPGA
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CANBUS, EBI/EMI, ETHERNET, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
CORE PROCESSOR: QUAD ARM® CORTEX®-A53 MPCORE? WITH CORESIGHT?, DUAL ARM®CORTEX?-R5 WITH CORESIGHT?, ARM MALI?-400 MP2
DETAILED DESCRIPTION: QUAD ARM® CORTEX®-A53 MPCORE? WITH CORESIGHT?, DUAL ARM®CORTEX?-R5 WITH CORESIGHT?, ARM MALI?-400 MP2 SYSTEM ON CHIP (SOC) IC ZYNQ® ULTRASCALE+? MPSOC EG ZYNQ®ULTRASCALE+? FPGA, 599K+ LOGIC CELLS 256KB 500MHZ, 600MHZ, 1.2GHZ 900-FCBGA (31X31)
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: XILINX INC.
MANUFACTURER PART NUMBER: XCZU9EG-1FFVC900I
MANUFACTURER STANDARD LEAD TIME: 10 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 4 (72 HOURS)
NUMBER OF I/O: 204
OPERATING TEMPERATURE: -40°C ~ 100°C (TJ)
PACKAGE / CASE: 900-BBGA, FCBGA
PACKAGING: TRAY
PERIPHERALS: DMA, WDT
PRIMARY ATTRIBUTES: ZYNQ®ULTRASCALE+? FPGA, 599K+ LOGIC CELLS
RAM SIZE: 256KB
SERIES: ZYNQ® ULTRASCALE+? MPSOC EG
SPEED: 500MHZ, 600MHZ, 1.2GHZ
STANDARD PACKAGE: 1
SUPPLIER DEVICE PACKAGE: 900-FCBGA (31X31)








