ADDITIONAL FEATURE:  ON-CHIP 512 BYTE BRANCH TARGET CACHE; MULTIPROCESSOR SUPPORT; 4 STAGE PIPELINE; BURST BUS

ADDRESS BUS WIDTH:  32

BIT SIZE:  32

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  40 MHZ

EXTERNAL DATA BUS WIDTH:  32

FORMAT:  FIXED POINT

INTEGRATED CACHE:  NO

JESD-30 CODE:  S-CPGA-P169

JESD-609 CODE:  E0

LENGTH:  44.704 MM

LOW POWER MODE:  NO

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  AM29000-20/BZC

NUMBER OF DMA CHANNELS:  0

NUMBER OF EXTERNAL INTERRUPTS:  6

NUMBER OF SERIAL I/OS:  0

NUMBER OF TERMINALS:  169

ON CHIP DATA RAM WIDTH:  0

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  PGA

PACKAGE DESCRIPTION:  PGA, PGA169,17X17

PACKAGE EQUIVALENCE CODE:  PGA169,17X17

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  PGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  169

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  0

SCREENING LEVEL:  38535Q/M;38534H;883B

SEATED HEIGHT-MAX:  4.953 MM

SPEED:  20 MHZ

SUBCATEGORY:  MICROPROCESSORS

SUPPLY CURRENT-MAX:  500 MA

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  4.5 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  MILITARY

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  PIN/PEG

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  PERPENDICULAR

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  44.704 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC