ADDRESS BUS WIDTH:  20

BIT SIZE:  16

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  10 MHZ

EXTERNAL DATA BUS WIDTH:  16

FORMAT:  FIXED POINT

INTEGRATED CACHE:  NO

JESD-30 CODE:  R-GDIP-T40

JESD-609 CODE:  E0

LENGTH:  52.2605 MM

LOW POWER MODE:  NO

MANUFACTURER:  AMD

MANUFACTURER PART NUMBER:  D8086-1

NUMBER OF DMA CHANNELS:  0

NUMBER OF EXTERNAL INTERRUPTS:  2

NUMBER OF SERIAL I/OS:  0

NUMBER OF TERMINALS:  40

ON CHIP DATA RAM WIDTH:  0

OPERATING TEMPERATURE-MAX:  70 °C

OPERATING TEMPERATURE-MIN:  0 °C

PACKAGE BODY MATERIAL:  CERAMIC, GLASS-SEALED

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP40,.6

PACKAGE EQUIVALENCE CODE:  DIP40,.6

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  40

POWER SUPPLIES:  5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (WORDS):  0

SEATED HEIGHT-MAX:  6.096 MM

SPEED:  10 MHZ

SUBCATEGORY:  MICROPROCESSORS

SUPPLY CURRENT-MAX:  340 MA

SUPPLY VOLTAGE-MAX:  5.25 V

SUPPLY VOLTAGE-MIN:  4.75 V

SUPPLY VOLTAGE-NOM:  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  NMOS

TEMPERATURE GRADE:  COMMERCIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  15.24 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR