ADDITIONAL FEATURE:  ALSO REQUIRES 3.3V SUPPLY

ADDRESS BUS WIDTH:  13

BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  66.66 MHZ

EXTERNAL DATA BUS WIDTH:  32

FORMAT:  FIXED POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-PBGA-B324

LENGTH:  23 MM

LOW POWER MODE:  YES

MANUFACTURER:  APPLIED MICRO CIRCUITS CORPORATION

MANUFACTURER PART NUMBER:  IBM25NPE405L-3FA266C

NUMBER OF TERMINALS:  324

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PIN COUNT:  324

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  2.65 MM

SPEED:  266 MHZ

SUPPLY VOLTAGE-MAX:  2.7 V

SUPPLY VOLTAGE-MIN:  2.3 V

SUPPLY VOLTAGE-NOM:  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  23 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC