ADDRESS BUS WIDTH:  32

BIT SIZE:  32

BOUNDARY SCAN:  YES

CLOCK FREQUENCY-MAX:  100 MHZ

EXTERNAL DATA BUS WIDTH:  64

FORMAT:  FLOATING POINT

INTEGRATED CACHE:  YES

JESD-30 CODE:  S-CBGA-B255

LENGTH:  21 MM

LOW POWER MODE:  YES

MANUFACTURER:  IBM

MANUFACTURER PART NUMBER:  IBM25EMPPC740GBUF2000

NUMBER OF TERMINALS:  255

PACKAGE BODY MATERIAL:  CERAMIC, METAL-SEALED COFIRED

PACKAGE CODE:  BGA

PACKAGE DESCRIPTION:  BGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY

PART PACKAGE CODE:  BGA

PIN COUNT:  255

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3 MM

SPEED:  200 MHZ

SUPPLY VOLTAGE-MAX:  2.625 V

SUPPLY VOLTAGE-MIN:  2.375 V

SUPPLY VOLTAGE-NOM:  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TERMINAL FORM:  BALL

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  BOTTOM

WIDTH:  21 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR, RISC